The Wii U’s Innards

This time, Iwata interviews the hardware engineers of Nintendo.

Larger fans, larger heatsinks, and an AMD GPU that dwarfs the IBM processor:

What’s interesting is the mention of the Wii U’s MCM, or Multi-Chip Module which contains the CPU, GPU, and 2GB of RAM all on one chip; thus lowering the latency, power consumption, and overall size to a minimum:

The system, according the engineers, generates up to three times the heat of its predecessor (probably due to the AMD chip), requiring the larger fans and heatsinks. You can see the full interview at the source.

I want that transparent case!