This time, Iwata interviews the hardware engineers of Nintendo.
Larger fans, larger heatsinks, and an AMD GPU that dwarfs the IBM processor:
What’s interesting is the mention of the Wii U’s MCM, or Multi-Chip Module which contains the CPU, GPU, and 2GB of RAM all on one chip; thus lowering the latency, power consumption, and overall size to a minimum:
The system, according the engineers, generates up to three times the heat of its predecessor (probably due to the AMD chip), requiring the larger fans and heatsinks. You can see the full interview at the source.
I want that transparent case!
Source:
Nintendo
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For some reason it reminds me of the 360 and that’s scary…
I have to give respect where it is due. For Nintendo to take apart it’s hardware on their own accord shows that they aren’t bashful about what is under the hood. I still would have liked them to state exactly what GPU and CPU they are using, but from what I’ve seen and heard, it is enough to play current titles at 1080p at decent setting with some AA, which isn’t bad.
Well, if you look at what’s been said about the GPU and CPU… and what’s been shown…
GPU’s more powerful than a PS3/X360 and capable of 1080p graphics. It’s probably like a medium/low end 6 series or a medium/low end 7 series. The games looks pretty good but it lacks a lot of the smaller things… (AA, AF, high end dynamic shadows, reflections, etc…)
CPU’s been said to be weaker than X360/PS3. So ya. Betting it’s still a old design that’s got in-order execution, higher clocked around 3.5 ghz to 4.0 ghz.(since it’s IBM’s processor and they usually push for higher clocks)